Chip-on-Board (COB) for Displays LCD and OLED

LCD displays require one or more driver chips for control. These ICs are either placed directly on a board (as COB or SMD) or as COG (Chip-On-Glass) directly on the LC glass.
In the chip-on-board technique, the semiconductor chip (driver) is glued directly onto a board material and connected via bonding wires. In Chip On Board technology, the IC and the bonding wires are sealed with a drop of potting compound for protection.
Chip On Board displays are widely used and are cheaper than LCD modules in SMD assembly. ELECTRONIC ASSEMBLY supplies LCD modules from 1x8 characters (DIP module as COB) up to 4x40 characters (standard displays) in COB technology. Chip On Board is increasingly replaced by COG (DOG series).

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